銅系リードフレームはんだ付部の脆化特性

概要

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Copper base alloys, containing 2.4 mass%Fe and 0.1 mass%Zn, etc, were soldered using Pb-63%mass%Sn and then heated at 100℃, 125℃ and 150℃ for 1000〜2000 h to grow intermetallic compounds at the solder/alloy interfase. Elemental analysis at the interfase was performed by using EPMA. The fractured interfase, where the solder was peeld off after the 30° bending test, was observed by optical microscopy, and the concentrated elements were analyzed by EPMA. The copper alloy containing Fe, Zn showed a higher intermetallic compound growth rate, thus larger decreasing in the peel strength at the soldered joint. Intermetallic compounds formed at the solder-copper alloy interface were found to be typically, at the solder side, η-cu_6sn_5,and, at the copper alloy side, ε-cu_3sn in which Iron element was found to have been segregated.
社団法人溶接学会の論文
1998-02-05