低融点りん銅ろうに関する研究(第 I 報) : Sn 入りりん銅ろうについて

概要

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A new copper phosphorous self-fluxing brazing filler alloy usable at 650℃ has been developed by the addition of tin to Cu-Ag-P alloy. The influence of tin and phosphorous content on the brazability at 650℃ has been investigated by evaluating the penetration length of filler alloy between two copper plates of 0.1mm lap joint clearance. Differential thermal analysis and metallographic observation were also carried out to define the temperature ranges of melting and the phase Changes. Within the range of this investigation, the available filler alloy composition was found to be Ag/Cu(15/65)-15%Sn-(3∿3.5)%P. The solidus and liquidus temperatures of the alloys were about 475℃ and 620-650℃, respectively. The alloys of more than 3.5%P content having primary Cu_3P phase showed poor penetration length because phosphorous content in coexisting liquid decreased due to the formation of Cu_3P. On the other hand, the alloys of less than 3.5%P content crystallized primary Cu(α) phase, and then the coexisting liquid contained more phosphorous than the nominal concentration. Accordingly, the alloys exhibited excellent fluxing action.
社団法人溶接学会の論文
1980-09-05