Cu-Ag-PおよびCu-Sn-P系ろう合金の状態図的検討 : 低融点りん銅ろうに関する研究(第II報)

概要

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Liquidus plane and some cross sectional phase diagrams of Cu-Ag-P and Cu-Sn-P ternary alloys at copper rich corner were established using differential thermal analysis and microscopic observations. Primary phase planes of copper solid solution (Cu) and Cu_3P phase were divided by a straight line which started from Cu-P system binary eutectic composition. In respect of the primary phase, the addition of tin was similar to the phosphorus addition, because the primary phase changed from Cu phase to Cu_3P phase at lower phosphorus. The phosphorus equivalent of tin was determined to be 0.238 in case of mass% expression. The phosphorus equivalent of silver was only 0.066. The spreadability of Cu-Sn-P filler metals were inferior to that of Cu-Ag-P, which is explained by the thermodynamic calculation that tin oxide is not so easily reduced by phosphorus. The activation energy of erosion of copper base metal was coincided well with that of diffusion of tin in solid copper.
社団法人溶接学会の論文
1987-02-05