ろう付用アミン塩酸塩フラックスの作用機構に関する研究(第 3 報)

概要

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In this report, various amine hydrochloride flux action of soldering was studied on the relation between the reaction of flux with base metal or with Sn-Pb alloy solder and spreading phenomenon. The experimental results obtained are as follows ; 1) Aniline hydrochlord idie reacted with Sn-Pb alloy solder at 250℃ to give SnCl_2,PbCl_2 and aniline. The corrosion rate increased on going to Sn-36% Pb, to Sn-10% Pb and to Sn. 2) The addition of SnCl_2 to C_6H_5NH_2HCl had little effect on improement of spreading of Sn-Pb eutectic alloy solder, because SnCl_2 reacted with Pb in the solder to give PbCl_2 and the property of the solder changed greatly. 3) The increase in the corrosion rate of various fluxes with Cu plate caused the increase in spread of Sn solder with these fluxes. 4) Aniline hydrochloride reacted with Cu plate to give aniline and CuCl_2,which reacted with molten Sn to give SnCl_4 and Cu. And the Cu produced dissolved into Sn solder. 5) The addition of CuCl_2 to C_6H_5NH_2HCl had a great effect on improvement of spreading of all the solders, Sn, Sn-5% Pb and Sn-10% Pb. When CuCl_2 added to C_2H_5NH_2HCl, the effect was more great.
社団法人溶接学会の論文
1973-11-25