Friction Welding of Copper-Tungsten Sintered Alloy to Pure Aluminum : Formation of Intermetallic Compound at Weld (Report 1)

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The microstructure and bond strength of the friction-welded joint of Al (commercially pure aluminum) to Cu-W (coppertungsten sintered) alloy of various W contents have been investigated with particular reference to effects of W particles on the formation of intermatallic compounds at the weld interface and on resulting mechanical properties of the joint. A lot of mixing layers of Cu, Al and W were formed by picking-up of Cu and W into Al in the joint of Al to Cu-W alloy with W content less than 30 mass%, whereas no mixing layer was formed for W contents more than 50 mass%. Since the mixing layer included a number of brittle intermetallic compound layers, tensile strength of joints of Al to Cu-W with W contents below 30 mass% was considerably lower than that of ones with W contents above 50 mass%. The highest temperature of friction interface during the friction-welding, estimated form thermoelectric power, between Cu and Al, was about 800 K both for the joint of Al to Cu-W in cluding 70mass% W and for the joint of Al to oxygen free copper (including no W particle). Microhardness of the Cu-W alloy with 50 mass% W was significantly higher than that of W contents belows below 30 mass% at temperatures ranging from room temperature to 800 K. This suggests that the flow stress of Cu-W alloys containing W above 50 mass% was significantly higher than that of W contents below 30 mass%. This difference in the flow stress of the Cu-W alloy prevented the formation of mixing layer in the joint of Al to Cu-W alloy with W contents above 50 mass%, since it needed plastic flow and rupture of Cu-W alloy to pick up Cu and W from Cu-W alloy into Al.
社団法人溶接学会の論文
1993-04-01

Friction Welding of Copper-Tungsten Sintered Alloy to Pure Aluminum : Formation of Intermetallic Compound at Weld (Report 1)

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