Influence of Surface Treatment on the Strength of Solid-State Diffusion-Bonded Interface of Tin(Materials, Metallurgy & Weldability, INTERNATIONAL SYMPOSIUM OF JWRI 30TH ANNIVERSARY)

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An investigation has been made of the bond strength of diffusion-bonded interfaces of tin specimens whose faying surfaces were finished through four different treatments: grinding on emery of 800 grade, electrolytic polishing, halogenation by HCl, and halogenation by HF. Bonding temperatures necessary for obtaining bond strength comparable with the base metal were highest when the surfaces was finished by grinding on the emery paper, and decreased in the following order: grinding on the emery paper, electrolytic polishing, halogenation by HCl, and halogenation by HF. When the faying surfaces were subjected to the halogenization treatments, dimples were observed over almost whole areas of the fractured surface of the joint after the tensile test at bonding temperatures of 463-483K, and granular inclusions rich in Cl and F were observed with a SEM at the bottom of the dimples. In the case of the other surface treatments, however no dimples or inclusions could be detected at the same bonding temperatures. These results suggest that tin halides displaced the superficial oxide film of tin during the halogenation treatments, and were broken up to form granular inclusions at lower temperatures during the diffusion bonding.
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