Weld HAZ Toughness and Its Improvement of Low Alloy Steel SQV-2A for Pressure Vessels (Report 2) : Microstructure and Charpy Impact Behavior of Intercritically Reheated Coarse Grained Heat Affected Zone (ICCGHAZ)(Materials, Metallurgy & Weldability)
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概要
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Effects of peak temperature Tp2 and cooling time Δt8/5(2) eff of the second thermal cycle on the impact properties and microstructures of ICCGHAZ during multi-pass welding were investigated in this study. ICCGHAZs were simulated with thermal/mechanical simulator Gleeble 1500. Microstructures were examined by optical microscopy, scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The results showed that Charpy impact properties of ICCGHAZs were strongly influenced by the peak temperature Tp2 and cooling time Δt8/5(2) eff of the second thermal cycle. For cooling time Δt8/5(2) eff of 6s, the loss in impact value was observed over a narrow range of Tp2, i.e. 973-1023K, but for cooling time Δt8/5(2) eff of 40s, the loss in impact value was observed over a wide range of Tp2, i.e. 973-Ac3. For peak temperature Tp2 in the range 923-1023K, the loss in impact value was found to be due to the formation of M-A constituents in the interior of the grains and the necklace-like blocky structures along grain boundaries for both cooling times. However, for peak temperature Tp2 higher than 1023K, impact value was recovered in the case of 6s because most of the prior structure was reaustenized and transformed into martensite, but the impact value was still low in the case of 40s because upper bainite was formed upon cooling. It can be concluded from the results that M-A constituents in the interior of the grains and necklace-like blocky structures along grain boundaries impair the toughness of ICCGHAZ, and the toughness of ICCGHAZ is also affected by the microstructures of matrix.
- 大阪大学の論文
著者
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MATSUDA Fukuhisa
Osaka University
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IKEUCHI Kenji
Osaka University
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LIAO Jinsun
Osaka University
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Liao J
Kurimoto Ltd. Osaka Jpn
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Ikeuchi K
Kyoto Univ. Kyoto Jpn
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Matsuda F
Osaka University
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Ikeuchi K
大阪大学接合科学研究所
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Tanabe Hiroki
Osaka University:(present Office)horiba Co. Ltd.
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Matsuda Fukuhisa
Osaka Univ.
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TANABE Hiroki
Osaka University
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