Study of Microscopic Process of Diffusion Welding by Electric-Resistance Measurement and Transmission Electron Microscope
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The measurement of electric resistance across a bonding interface and observation of microstructures for a bonding zone with a transmission electron microscope (TEM) have been applied to the investigation of microscopic process of aluminum diffusion welding. The variation of the resistance across the bonding interface has been measured while heating the bonding zone at a constant rate of 15℃/min. The resistance is much higher than the resistivity of matrix at room temperature and nearly equal to the resistivity of matrix at temperatures higher than 620℃. These phenomena indicate that the oxide film on the faying surface prevents the real metallic contact up to such high temperature as just below the melting point. The existence of voids and oxide film at the bonding interface during diffusion welding has been confirmed by the observation of the microstructure for bonding zone with a TEM.
- 大阪大学の論文
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