Disjunction of Metal/Glass Anodically-bonded Interface by Application of Reverse Voltage(Materials, Metallurgy & Weldability)
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概要
- 論文の詳細を見る
A voltage in the opposite direction to that of anodic bonding was applied to anodically-bonded joints of Fe and Kovar alloy (Fe-Ni-Co alloy) to borosilicate glass at a temperature at which thermal diffusion of the alkali ions in the glass was activated. Disjunction of the bond interfaces occurred in the Kovar/glass joints. On the other hand, the Fe/glass joints retained cohesion of their bond interface after a long application of reverse voltage. At the bond interface in an as-bonded Kovar/glass joint, a reaction layer of crystalline Fe oxide formed by the reaction between Fe from the Kovar alloy and O from the glass. The content of Fe in the Kovar alloy adjacent to the bond interface decreased. In an Fe/glass joint a reaction layer of amorphous Fe-Si oxide formed. This layer was much thicker than the reaction layer in the Kovar/glass joint. After application of the reverse voltage, Fe in the amorphous oxide layer in the Fe/glass joint was replaced by alkali ions. It was suggested that this process mitigated concentration of alkali ions at the bond interface and the formation of a Na rich brittle phase. The Kovar alloy adjacent to the bond interface in the Kovar/glass joint was rich in Ni and Co contents. This result suggested that properties of the Kovar/glass bond interface were similar to those of Ni/glass or Co/glass bond interface to some extent. Effects of reverse voltage on anodically-bonded Ni/glass and Co/glass joints were examined, and disjunction occurred in both joints. From these results it was suggested that the disjunction in anodically-bonded Kovar/glass interface was caused by the alloying elements Ni and Co.
- 大阪大学の論文
著者
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Yasuda Hiroki
Osaka University:(present Office)fujitsu Co. Ltd.
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TAKAHASHI Makoto
Osaka University
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IKEUCHI Kenji
Osaka University
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