Degradation in Diffusion-welded Joint of Dissimilar-metal Combination at Elevated Temperatures(Materials, Metallurgy & Weldability)
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概要
- 論文の詳細を見る
When a welded joint between dissimilar metals is held at elevated temperatures, the diffusion in the vicinity of bond interface causes a change in the microstructure of bond. In the present paper, such change in the microstructure of bond and its effect on the joint strength have been investigated for diffusion-welded joints of tough pitch copper (TPC) to nickel (Ni) and of TPC to iron (Fe). For diffusion-welded joints of TPC to Ni held at temperatures above 650℃, many particles of nickel oxide and voids were observed in the TPC base metal adjacent to the bond interface. The formation of these nickel oxide and voids were reduced remarkably when a base metal of oxygen free high conductivity copper was used instead of the TPC base metal. This result suggests that the nickel oxide forms by the reaction of nickel with oxygen involved in the TPC base metal and the nickel oxide promotes the formation of voids ; i.e., the nickel oxide is considered to act as a nucleation site of void due to the Kirkendall effect. The formation of these nickel oxide and voids is considered to cause the degradation in the joint strength. The degradation in the joint strength was observed when the joint was subjected to the holding for at least 15min at temperatures above 570℃. When a joint of TPC to Fe was held at temperatures above 770℃, many iron-oxide particles (or precipitates of iron) were observed in the TPC base metal adjacent to the bond interface. However, in contrast to the joint of TPC to Ni no void was observed in the joint of TPC to Fe. This result can be related to the fact that the amount of voids due to the Kirkendall effect is much less in the joint of TPC to Fe than in the joint of TPC to Ni. The degradation in the joint of TPC to Fe at elevated temperatures is considered to be very slight compared with that in the joint of TPC to Ni, since the formation of void is not observed in the joint of TPC to Fe.
- 大阪大学の論文
著者
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Akikawa N
Osaka University:(present Office)kawasaki Heavy Industries Ltd.
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IKEUCHI Kenji
Osaka University
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ENJO Toshio
Osaka University
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AKIKAWA Naofumi
Osaka University
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