チップ・スケール・パッケージ界面の機械・化学的性質

概要

論文の詳細を見る
Chip scale package (CSP) has been developed for center pad memory devices. The CSP is classified into two designs, tapeless lead on chip (LOC) and flexible substrate, respectively. The CSP with a LOC design consists of a polyimide-deposited chip which is bonded to a lead frame and then encapsulated with a molding compound. The CSP made with flexible a substrate consists of a polyimide-deposited chip which is boned to the flexible substrate with a thermoplastic polyimide and subsequently encapsulated with a liquid epoxy compound. Wire bonding technology was used for both of CSPs. A 52 ball package is composed of solder balls (0.6 mm in diameter on a 1.00 mm pitch) which are attached to either the lead frame or the flexible substrate. This paper focused on mechanical and chemical characteristics of package interface and solder joint reliability.
社団法人電子情報通信学会の論文
1997-12-12