F-0525 EPDペレットによるSiウエハの鏡面研削 : 空気冷却による冷却効果について(J17-2 マイクロトライボロジー&プロセッシング(2))(J17 マイクロトライボロジー&プロセッシング)

概要

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Recently, miniaturization technologies of electronic parts have advanced and the thinning technique of IC chips has become more important. Generally, thinning of IC chips is done by grinding the back surface of wafer with a diamond wheel after sticking a protection tape on the patterned surface. However, diamond grinding yields subsurface damage which causes warping or cracking of the silicon wafer. So far, we have developed EPD pellets composed of fine silica particles, which can be used for dry grinding of the wafer and hardly introduce subsurface damage. Therefore the EPD pellets are considered applicable to the back grinding. On the other hand, dry grinding produces more heat which may damage the protection film as well as the patterned circuits. In this study, to investigate the influence of grinding heat, temperature distribution on the wafer was measured for back grinding of silicon wafer with EPD pellet. Moreover effects of cooling by compressed air blow were examined.
一般社団法人日本機械学会の論文
2001-08-22