積層セラミックスコンデンサー内部電極用Ag-Pd合金粉末の合成と評価(第2報) : Ag-Pd(70-30)合金粉末のペースト物性評価

概要

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Physical and electrical properties of three types of Ag-Pd pastes, consist of different metal fine powders, a coprecipitated, an agglomerated alloy made by heat treatment and a dispersed alloy produced by improved pulverization method, have been studied. The dispersed alloy powder paste shows a high packing density(6.3g/cm^3)of dried film compared to others. The film shows a lower expansion at around 500°C and a lower shrinkage from 700 to 1100°C and a lower electrical resistivity after firing. The results indicated that the paste having an improved pulverized Ag-Pd alloy is superior to other two for internal electrode material for multilayer ceramic device.
社団法人日本セラミックス協会の論文
1999-04-01