アルミナ組成とW粒径がWメタライズアルミナ基板のメタライズ接合強さに及ぼす影響

概要

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The effects of the alumina content, alumina particle size, and flux of the alumina substrate and the W particle size of the W paste on the metallizing bonding strength and the relationship between the metallizing bonding strength and co-firing temperature were examined. The relationship between the W metallizing bonding strength and the co-firing temperature was changed largely as the alumina content, alumina particle size, flux, and W particle size changed. We obtained the metallizing bonding strength of 40 N/mm or higher even at the cofiring temperature of 1450°C by setting the alumina content to 93.1%, alumina particle size to 1.1μm, and W particle size of the W paste to 0.4μm. We assumed that this matallizing bonding strength was produced since the glassy phase generated when the alumina substrate was sintered was strongly engaged to the W network formed at a high temperature.
社団法人粉体粉末冶金協会の論文