Plasma Cure Process for Porous SiOCH Films using CF_4 Gas
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概要
- 論文の詳細を見る
- 2007-09-19
著者
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Ogawa Shinichi
Semiconductor Leading Edge Technologies Inc.
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Ogawa Shinichi
Semiconductor Leading Edge Technologies Inc. (selete)
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Nakahira Junya
Semiconductor Leading Edge Technologies Inc. (selete)
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TOMIOKA Kazuhiro
Semiconductor Leading Edge Technologies, Inc. (Selete)
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KONDO Seiichi
Semiconductor Leading Edge Technologies, Inc. (Selete)
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SAITO Shuichi
Semiconductor Leading Edge Technologies, Inc. (Selete)
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Tomioka Kazuhiro
Semiconductor Leading Edge Technologies Inc. (selete)
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Kondo Seiichi
Semiconductor Leading Edge Technologies Inc. (selete)
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Saito Shuichi
Semiconductor Leading Edge Technologies Inc. (selete)
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OGAWA Shinichi
Semiconductor Leading Edge Technologies, Inc. (Selete)
関連論文
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- Nano-meter order Structures of Porous Low-k Films and their Impacts on Cu/Low-k Processes
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- Process-Induced Damage Characterization of Patterned Low-$\kappa$ Film Using Electron Energy Loss Spectroscopy Technique
- SiOCH Films with Hydrocarbon Network Bonds : First-Principles Investigation
- Fabrication of 70-nm-Pitch Two-Level Interconnects by using Extreme Ultraviolet Lithography
- High-Etching-Selectivity Barrier SiC ($k
- Galvanic Corrosion Control in Chemical Mechanical Polishing of Cu Interconnects with Ruthenium Barrier Metal Film
- Etch-Byproduct Pore Sealing for Atomic-Layer-Deposited-TaN Deposition on Porous Low-$k$ Film
- Effect of Dissolved Oxygen on Cu Corrosion in Single Wafer Cleaning Process
- Carbon-Doped Silicon Oxide Films with Hydrocarbon Network Bonds for Low-$k$ Dielectrics: Theoretical Investigations