Characterization of Low-k Interconnect Dielectrics by EELS
スポンサーリンク
概要
- 論文の詳細を見る
- 2006-09-13
著者
-
Otsuka Yuji
Toray Research Center Inc.
-
Ogawa Shinichi
Semiconductor Leading Edge Technologies Inc.
-
SHIMADA Miyoko
Semiconductor Leading Edge Technologies Inc. (Selete)
-
Shimada Miyoko
Semiconductor Leading Edge Technologies Inc.
-
KAWASAKI Naohiko
Toray Research Center, Inc.
-
Kawasaki Naohiko
Toray Research Center Inc.
関連論文
- Plasma Cure Process for Porous SiOCH Films using CF_4 Gas
- Plasma-Enhanced ALD Ru Thin Films on PVD-TaN Films with Smooth Morphology at Low Temperature Using DER Ru Precursor
- Etch-byproduct Pore Sealing for ALD-TaN Deposition on Porous Low-k Film
- Characterization of Low-k Interconnect Dielectrics by EELS
- Nano-meter order Structures of Porous Low-k Films and their Impacts on Cu/Low-k Processes
- A Low Parasitic Capacitance Scheme by Thermally Stable Titanium Silicide Technology for High Speed Complementary-Metal-Oxide-Semiconductor
- Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance
- Process-Induced Damage Characterization of Patterned Low-$\kappa$ Film Using Electron Energy Loss Spectroscopy Technique
- Kramers-Kronig Analysis of a-Si/SiNx Interface Structure
- Hole Donors in the High-T_c Phase of a Bi-Pb-Sr-Ca-Cu Oxide Superconductor
- Observation of the High-T_c Phase and Determination of the Pb Position in a Bi-Pb-Sr-Ca-Cu Oxide Superconductor
- Three-Dimensional Elemental Analysis of Commercial 45nm Node Device with High-k/Metal Gate Stack by Atom Probe Tomography
- Etch-Byproduct Pore Sealing for Atomic-Layer-Deposited-TaN Deposition on Porous Low-$k$ Film
- Three-Dimensional Spatial Distributions of Pt Catalyst Nanoparticles on Carbon Substrates in Polymer Electrolyte Fuel Cells