Ogawa Shinichi | Semiconductor Leading Edge Technologies Inc.

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著作論文

Plasma Cure Process for Porous SiOCH Films using CF_4 Gas
Plasma-Enhanced ALD Ru Thin Films on PVD-TaN Films with Smooth Morphology at Low Temperature Using DER Ru Precursor
Etch-byproduct Pore Sealing for ALD-TaN Deposition on Porous Low-k Film
Characterization of Low-k Interconnect Dielectrics by EELS
Nano-meter order Structures of Porous Low-k Films and their Impacts on Cu/Low-k Processes
A Low Parasitic Capacitance Scheme by Thermally Stable Titanium Silicide Technology for High Speed Complementary-Metal-Oxide-Semiconductor
Novel Air-gap Formation Technology Using Ru Barrier Metal for Cu Interconnects with High Reliability and Low Capacitance
Process-Induced Damage Characterization of Patterned Low-$\kappa$ Film Using Electron Energy Loss Spectroscopy Technique
Etch-Byproduct Pore Sealing for Atomic-Layer-Deposited-TaN Deposition on Porous Low-$k$ Film

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