Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump
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概要
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Room-temperature Cu--Cu bonding was realized by applying ultrasonic vibration together with compression force to the bonding of a cone-shaped bump. The size of the bump was about 10 μm. The connection pitch was 20 μm. Mechanical characterization showed that the bonding strength increases with vibration amplitude and depends on the thickness of the counter electrode made of Cu. The thickness dependence of the bonding strength was found to be caused by an increase in the surface roughness of the counter electrode. It was shown that the bonding strength meets the requirement from application to products. Electrical characterization using a daisy-chain connection test demonstrated that more than 10,000 pins on a chip can be connected with a sufficiently low resistance.
- 2013-04-25
著者
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Asano Tanemasa
Graduate School Of Information Science And Electrical Engineering Kyushu University
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Ikeda Akihiro
Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Noda Kazuhiro
Adwelds Co., Ltd., Nakagawa, Fukuoka 811-1201, Japan
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Asano Tanemasa
Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Qiu Lijing
Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Nakai Seiya
Adwelds Co., Ltd., Nakagawa, Fukuoka 811-1201, Japan
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