Room-Temperature Microjoining of LSI Chips on Poly(ethylene naphthalate) Film Using Mechanical Caulking of Au Cone Bump
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概要
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We show that room-temperature bonding of LSI chips on a resin film made of poly(ethylene naphthalate) (PEN) can be realized by using mechanical caulking of a cone-shaped bump electrode made of Au. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode with cross-shaped slits on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. Bonding of about 10,000 bump connections with 184 m\Omega/bump has been achieved at room temperature.
- 2012-04-25
著者
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Asano Tanemasa
Graduate School Of Information Science And Electrical Engineering Kyushu University
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Ikeda Akihiro
Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Watanabe Naoya
Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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Shuto Takanori
Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
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