Buffer-Related Degradation Aspects of Single and Double-Heterostructure Quantum Well InAlN/GaN High-Electron-Mobility Transistors
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概要
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We experimentally prove the viability of the concept of the double-heterostructure quantum well InAlN/GaN high-electron-mobility transistor (HEMT) for the device higher robustness and reliability. In the single quantum well InAlN/GaN HEMTs, the intrinsic channel resistance increases by 300% after 1 h off-state stress; much less degradation is observed in the double-heterostructure device with an AlGaN back barrier. Physics-based device simulation proves that the back barrier blocks the rate of carrier injection into the device buffer. However, whatever the quantum well design is, the energy of the injected electrons in the buffer of InAlN/GaN-based HEMTs is higher than that in the buffer of AlGaN/GaN HEMTs. This energy may be sufficient for releasing hydrogen from GaN point defects.
- 2012-05-25
著者
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GRANDJEAN Nicolas
Institute of Quantum Electronics and Photonics, Ecole Polytechnique Federale de Lausanne
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Gornik Erich
Institut Fur Festkorperelektronik Technical University Of Vienna
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Vitanov Stanislav
Advanced Materials And Device Analysis Group Inst. For Microelectronics Tu Wien
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Palankovski Vassil
Advanced Materials And Device Analysis Group Inst. For Microelectronics Tu Wien
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Dua Christian
Alcatel-thales Iii-v Lab
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Kuzmik Jan
Institute Of Electrical Engineering Slovak Academy Of Sciences
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Ostermaier Clemens
Institute of Solid State Electronics and Center for Micro and Nanostructures, Vienna University of Technology, A-1040 Vienna, Austria
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Carlin Jean-Francois
Institute of Condensed Matter Physics, Ecole Polytechnique Federale de Lausanne, 1015 Lausanne, Switzerland
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Alexewicz Alexander
Institute of Solid State Electronics, Vienna University of Technology, Floragasse 7, 1040 Vienna, Austria
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Strasser Gottfried
Institute of Solid State Electronics, Vienna University of Technology, Floragasse 7, 1040 Vienna, Austria
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Pogany Dionyz
Institute of Solid State Electronics, Vienna University of Technology, Floragasse 7, 1040 Vienna, Austria
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Delage Sylvain
Alcatel-Thales III--V Lab, Route de Nozay, 91460 Marcoussis, France
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Pogany Dionyz
Institute for Solid State Electronics, Vienna University of Technology, Floragasse 7, A-1040 Vienna, Austria
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Strasser Gottfried
Institut für Festkörperelektronik, TU-Wien, Floragasse 7, 1040-Wien, Austria
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Gornik Erich
Institute of Solid State Electronics, Vienna University of Technology, Floragasse 7, 1040 Vienna, Austria
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Grandjean Nicolas
Institute of Condensed Matter Physics, Ecole Polytechnique Fédérale de Lausanne, CH-1015 Lausanne, Switzerland
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Grandjean Nicolas
Institute of Condensed Matter Physics, Ecole Polytechnique Federale de Lausanne, 1015 Lausanne, Switzerland
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Vitanov Stanislav
Advanced Materials and Device Analysis Group, Institute for Microelectronics, Vienna University of Technology, Gusshausstr. 27-29, 1040 Vienna, Austria
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Kuzmik Jan
Institute of Electrical Engineering, Slovak Academy of Sciences, Dubravska Cesta 9, 84104 Bratislava, Slovakia
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Dua Christian
Alcatel-Thales III--V Lab, Route de Nozay, 91460 Marcoussis, France
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Palankovski Vassil
Advanced Materials and Device Analysis Group, Institute for Microelectronics, Vienna University of Technology, Gusshausstr. 27-29, 1040 Vienna, Austria
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