Influence of Titanium Liner on Resistivity of Copper Interconnects
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概要
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We performed a precise analysis on the titanium (Ti) liner effect on copper resistivity in comparison with Ta liner. The grain size and Ti distribution in the copper interconnects using the Ti liner were investigated by electron backscattering deflection (EBSD) and micro auger electron spectroscopy (μ-AES). It was found that the grain size with the Ti liner is smaller than that with Ta liner in wide lines. The μ-AES observation revealed that Ti atoms diffuse through random grain boundaries. The phenomenon of resistivity increase in copper lines with Ti liner was analyzed using the line resistivity model. It was found that the resistance increase can be explained by combining the decrease in grain size with the increase in grain boundary scattering coefficient.
- 2009-04-25
著者
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SUZUKI Takashi
Fujitsu Laboratories Ltd.
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Nakamura Tomoji
Fujitsu Lab. Ltd.
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KITADA Hideki
Fujitsu Laboratories Ltd
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Kitada Hideki
Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0197, Japan
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Akiyama Shinich
Fujitsu Microelectronics Ltd., 1500 Oino, Tado, Kuwana, Mie 511-0197, Japan
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Nakamura Tomoji
Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0197, Japan
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Suzuki Takashi
Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa 243-0197, Japan
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