Enhanced Extreme Ultraviolet Lithography Mask Inspection Contrast Using Fabry-Perot Type Antireflective Coating
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概要
- 論文の詳細を見る
In this paper, we describe two strategies for solving the low-contrast problem during extreme ultraviolet lithography (EUVL) mask inspection processes. One is the use of single-layer antireflective coating (ARC), and the other is the use of Fabry-Perot-type ARC. The materials of ARC are the same as those of buffer layers, such as SiO2 and Si3N4, which are easy to fabricate. Contrast can be increased up to ${>}95$% by adding ARC. For both absorbers, Single-layer Si3N4 ARC and Si3N4-based Fabry-Perot-type ARC show better performances than SiO2 ARC. Both types of ARC maintain a high contrast at 40% with a large thickness variation even until $\pm 40$%. Moreover, the top absorber in Fabry-Perot-type ARC has good conductivity that can eliminate electrical distortion, which is caused by electron charging during e-beam direct writing. The Fabry-Perot-type ARC structure has better contrast and thickness variation tolerance than the single-layer ARC structure. The film materials in Fabry-Perot structure can also be used for various absorber and dielectric materials.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-06-15
著者
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KO Fu-Hsiang
National Nano Device Lab.
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Lai Lee-jene
National Synchrotron Radiation Research Center
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CHENG Hsu-Chun
National Nano Device Lab.
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CHU Tieh-Chi
National Tsing Hua University
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Ko Tsung-shine
National Nano Device Laboratry
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Chen Hsuen-Li
Department of Electronics Engineering and Institute of Electronics, National Chiao-Tung University
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Chen Hsuen-Li
Department of Materials Science and Engineering, National Taiwan University, Taiwan, R. O. C.
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Chu Tieh-Chi
National Tsing Hua University, Hsinchu, Taiwan, R. O. C.
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Ko Tsung-Shine
National Tsing Hua University, Hsinchu, Taiwan, R. O. C.
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