Fabrication of a Silicon Micro-Probe for Vertical Probe Card Application
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概要
- 論文の詳細を見る
We report on the fabrication of a new type of probe card that uses a porous silicon micromachining technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal expansion coefficient between the films. The contact resistance of cantilever tips with an aluminum pad is basically below 1 Ω and there is no change of contact resistance after 700,000 contacts.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 1998-12-30
著者
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Sim Jun-hwan
Dept. Of Electronics & Communication Eng. Korea Maritime University
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Lee Jong-hyun
School Of Electrical Engineering And Computer Science Kyungpook National University
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KIM Yong-Dae
R&D Engineering Dep., Lumsonic Co. Ltd
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NAM Jae-Woo
R&D Engineering Dep., Lumsonic Co. Ltd
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Nam Jae-Woo
R&D Engineering Dep., Lumsonic Co. Ltd, Koyang 411-360, Korea
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Kim Yong-Dae
R&D Engineering Dep., Lumsonic Co. Ltd, Koyang 411-360, Korea
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Sim Jun-Hwan
Dept. of Electronics & Communication Eng., Korea Maritime University, Pusan 702-701, Korea
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Lee Jong-Hyun
School of Electronic & Electrical Eng., Kyunpook National University, Taegu 702-701, Korea
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