A Piezoresistive Silicon Accelerometer Using Porous Silicon Micromachining and Flip-Chip Bonding
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概要
- 論文の詳細を見る
A piezoresistive silicon accelerometer using porous silicon micromachining and flip-chip bonding is presented. This micromachining technique, which provides the benefits of surface micromachining along with the capabilities of bulk micromachining, was applied for fabricating the micromechanical structure of an accelerometer. The flip-chip bonding technology with numerous advantages, such as a low inductance and resistance, excellent high-frequency behavior, and high-density interconnection, compared to conventional interconnection methods, was also proposed. This bonding technology is thought to be promising for implementing electrical interconnections between the sensor chip and the substrate.
- 社団法人応用物理学会の論文
- 1999-04-15
著者
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Lee J‐h
Taiwan Semiconductor Manufacturing Co. Hsin‐chu Twn
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Sim Jun-hwan
Department Of Electronics And Communication Engineering Korea Maritime University
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Lee Jong-hyun
School Of Electrical Engineering And Computer Science Kyungpook National University
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