BGA LSIの実装時断線故障検出に対する交流電界印加による電流テスト

概要

論文の詳細を見る
The supply current test method for detecting open faults of CMOS LSI on the printed circuit board under the AC electric field was proposed in the past. In previous research, the test method have evaluated for the QFP LSI. However, BGA packages which have solder balls in the bottom-side of package have been used in recent years. Thus, usefulness of the current test method for the package was evaluated by the experiment. On the evaluation, "EPM2210F256C4N" manufactured by ALTERA Corporation which is CPLD with 256 solder balls have used. As the result, the opens of BGA LSI on the printed circuit board could be detected by the method. Moreover, it was confirmed that the voltage applying AC electric field for detecting opens on center of bottom-side on the package is larger than one of outside of the package.