A04 極少量スラリーによるスライシングに関する基礎的研究(OS13 環境適応形加工(1))

概要

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A slicing method of multi-wire saw is classified roughly into a loose grain method and a bonded abrasive method. Because there is a little kerf loss, a loose grain method is profitable to slicing of expensive work material. Additionally, precision slicing is possible because this method is a little damage to sliced surface, and there is comparatively a low cost. Therefore a loose grain method is adopted in slicing of wafer from a single crystal silicon ingot. However, as for a large quantity of used slurry, processing as the industrial waste is necessary. In addition to a problem for processing cost as industrial waste, consideration to environment is necessary in future. A main purpose of this study is large reduction of a quantity of use of slurry. Therefore the new slicing method is proposed which uses only slurry of the minimum quantity to be necessary for slicing. In this report, fundamental slicing performance of a proposed method is made clear. The main results obtained are as follows. The slicing in minimum quantity slurry is possible, but its precision is not so good generally.
一般社団法人日本機械学会の論文
2010-11-19