3404 水酸化フラーレンを用いた超平坦化加工に関する研究 : 第2報平坦化特性の検証(G13 生産加工・工作機械,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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CMP (Chemical Mechanical Polishing), which is a polishing process combining chemical effect by chelating agent and mechanical effect by abrasive grain, is a key technology for multilayered semiconductor. In this study, we propose the water-soluble fullerenol(C_<60>(OH)_x (X=12-44)) as abrasives. Because water-soluble fullerenol has good features such as uniformity of particle size (1 nm) and no metal contamination, it is suitable for abrasives of Cu-CMP in next-generation design rule. In this report, the planarization performance of water-soluble fullerenol slurries is investigated experimentally. It is investigated that the water-soluble fullerenol slurry can planarize the copper surface from 20 to 0.5 nm RMS in 2 min.
社団法人日本機械学会の論文
2008-08-02