ウェットブラスト加工に関する基礎的研究 : 投射固体粒子径の単結晶Siウェハの加工メカニズムへの影響(機械要素,潤滑,設計,生産加工,生産システムなど)

概要

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The wet blast technique has high potential for precision surface processing wherever tiny particles can be used. In this study, solid particle size effects on the wet blast processing mechanism of monocrystalline silicon wafers were investigated. Pure water, containing angular alumina particles of sizes ranging from 1.2μm (WA #8000) to 18.3μm (WA #800) at the concentration of 0.01mass% were impacted by using a micro slurry-jet erosion (MSE) apparatus. The impact scars due to single particle impingements were observed by SEM and AFM, while surfaces processed with a large number of particles were observed by a Laser Scanning Microscope (LSM). When the particle size was smaller than about 3μm, the impact scars were due to plastic deformation of the material, or to ductile fracture caused by micro cutting during single particle impingement. On the other hand, brittle fracture caused by lateral cracks was dominant for the particle size larger than about 3μm. The surfaces processed with a large number of particles showed the effects of repeated single impact scars. Therefore, the removal rate and the roughness were less in the processing by tiny particles because of the domination of plastic deformation or ductile fracture.
2010-03-25