ウェットブラスト加工に関する基礎的研究 : 単結晶Siウェハの表面加工に及ぼす投射固体粒子径の影響(機械要素,潤滑,設計,生産加工,生産システムなど)

概要

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A wet blast technique has high potential for precision surface processing when tiny particles can be used. In this study, the effect of particle size on the wet processing properties of monocrystalline silicon wafer was investigated, i.e. a fundamental study of the wet blast processing for brittle materials such as semiconductors and MEMS was conducted. Pure water, containing angular alumina particles whose sizes ranged from 1.2μm (WA#8000) to 8.3μm (WA#2000) at the concentration of 0.05 to 3mass% was impacted at an impingement angle of 90 degree by using a micro slurryjet erosion (MSE) apparatus. The depths of surface removal and the surface roughness were measured by a stylus profilometer. The removal rates and maximum roughness (Rz) increased with particle size, but the degree of these increases was much smaller in the range of WA#8000-6000 (1.2-2.4μm) than in the range of WA#4000-2000 (3.7-8.3μm). The critical particle size for smooth processing at shallow blasting depth was about 3μm in this experiment. This behaviors and its mechanism were also discussed by SEM observations of the blasted surfaces.
2010-02-25