128 砥粒を分散した粒子分散型流体を用いた電場援用研磨の基礎研究(OS-15 研磨技術)

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In this paper, we tried to examine a new polishing method for glass plate with electric field and diamond abrasives dispersion type fluid. It is already reported that diamond abrasives dispersed in kerosene fluid have been found to reciprocate between the electrodes if an adequate electric field is applied to the polishing area by the electrodes. In order to polish a glass surface, we suggested a polishing model that diamond abrasives reciprocate on the glass plate which is set on a multi-layered regular interval electrode. Firstly, we tried to clarify the fastest moving condition of diamond abrasives, which mean particle diameter was 2.0-4.0 μm, between a monopole electrode. As a result, we obtained the abrasives velocity of 101.7mm/s when square wave form was applied with a 4.0kV peak-to-peak (p-p) voltage and 1Hz frequency. This was approximately 3.5 times faster than a condition of sine wave or triangle wave form applied. Secondly, in order to investigate a relationship between a polishing time and peak-to-valley height, we carried out Atomic Force Microscope measurement for a glass plate after polishing test at the maximum abrasives velocity. After the 120min polished the glass surface, it was clear that peak-to-valley height of glass surface reduced from 20nmRy to 12nmRy at the above of the multi-layered electrodes edge. Moreover, it was found that peaks of glass surface were preferentially polished more than valleys of its surface.
社団法人日本機械学会の論文
2006-11-24

128 砥粒を分散した粒子分散型流体を用いた電場援用研磨の基礎研究(OS-15 研磨技術)

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