Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing

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Potential Energy Surface and Dynamics of Pd/MgO(001)System as Investigated by Periodic Density Functional Calculations and Classical Molecular Dynamics Simulations
Dependence of Time-Dependent Dielectric Breakdown Lifetime on NH_3-Plasma Treatment in Cu Interconnects
Dependence of Time-Dependent Dielectric Breakdown Lifetime on the Structure in Cu Metallization
Copper Wires for High Speed Logic LSI Prepared by Low Pressure Long Throw Sputtering Method
Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing
Molecular Adsorption on Ultrafine Precious Metal Particles Studied by Density Functional Calculation
Heat and Moisture Resistance of Low-Capacitance Multilevel Interconnections Using Low-Permittivity Organic Spin-On Glass
Time-Dependent Dielectric Breakdown of Interlevel Dielectrics for Copper Metallization
Directional Plasma CVD Technology for Sub-quarter-micron Feature Size Multilevel Interconnections
Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection
Low Permittivity Organic Dielectrics for Multilevel Interconnection in High Speed ULSIs
Reliability of Low-Parasitic-Capacitance Multilevel Interconnection Using Surface-Densified Low-ε Organic Spin-on Glass
Resistivity Increase In Ultrafine-Line Copper Conductor for ULSIs : Semiconductors
Fast Electromigration-lifetime Prediction of Al-based Layered Metallization using the Similarity of Resistance Increase Curve
Fast Electromigration-lifetime Prediction of Al-based Layered Metallization using the Similarity of Resistance Increase Curve

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