Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection

スポンサーリンク

概要

• 論文の詳細を見る
• 1997-09-16

著者

• Furusawa Takeshi

  Central Research Laboratory Hitachi Ltd.

• Sakuma N

  Toshiba Corp. Kawasaki Jpn

• Kudoh Yukie

  Hitachi Electronics Engineering Co. Ltd.

• HOMMA Yoshio

  Central Research Laboratory, Hitachi, Ltd.

• Sakuma Noriyuki

  Central Research Laboratory Hitachi Ltd.

• Furusawa T

  Tokyo Inst. Technol. Yokohama

• Homma Y

  Hitachi Ltd. Tokyo Jpn

• Homma Yoshio

  Central Research Laboratory Hitachi Ltd.

• KUDOH Yutaka

  Hitachi Electronics Engineering Co. Ltd.

関連論文

• Polyimide Optical Waveguide with Multi-Fan-Out for Multi-Chip Module Application
• Polyimide Optical Waveguide with Multi-Fan-Out for Multi-Chip Module Application
• Roughness Evaluation of Thermally Oxidized Si(111) Surfaces by Scanning Force Microscopy
• Hg-Sensitized Photochemical Vapor Depositiorn Application to Hydrogenated Amorphous Silicon Photoconversion Layer Overlaid on Charge Coupled Device
• Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing
• Heat and Moisture Resistance of Low-Capacitance Multilevel Interconnections Using Low-Permittivity Organic Spin-On Glass
• Time-Dependent Dielectric Breakdown of Interlevel Dielectrics for Copper Metallization
• Directional Plasma CVD Technology for Sub-quarter-micron Feature Size Multilevel Interconnections
• Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection
• Low Permittivity Organic Dielectrics for Multilevel Interconnection in High Speed ULSIs
• Reliability of Low-Parasitic-Capacitance Multilevel Interconnection Using Surface-Densified Low-ε Organic Spin-on Glass

もっと見る 閉じる

スポンサーリンク