Reliability of Low-Parasitic-Capacitance Multilevel Interconnection Using Surface-Densified Low-ε Organic Spin-on Glass

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概要

• 論文の詳細を見る
• 1996-08-26

著者

• Furusawa Takeshi

  Central Research Laboratory Hitachi Ltd.

• Homma Yoshio

  Central Research Laboratory Hitachi Ltd.

関連論文

• Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing
• Heat and Moisture Resistance of Low-Capacitance Multilevel Interconnections Using Low-Permittivity Organic Spin-On Glass
• Time-Dependent Dielectric Breakdown of Interlevel Dielectrics for Copper Metallization
• Directional Plasma CVD Technology for Sub-quarter-micron Feature Size Multilevel Interconnections
• Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection
• Low Permittivity Organic Dielectrics for Multilevel Interconnection in High Speed ULSIs
• Reliability of Low-Parasitic-Capacitance Multilevel Interconnection Using Surface-Densified Low-ε Organic Spin-on Glass

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