Low Permittivity Organic Dielectrics for Multilevel Interconnection in High Speed ULSIs

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概要

• 論文の詳細を見る
• 1995-08-21

著者

• Morishima Hiroyuki

  Hitachi Chemical Co. Ltd.

• Furusawa Takeshi

  Central Research Laboratory Hitachi Ltd.

• HOMMA Yoshio

  Central Research Laboratory, Hitachi, Ltd.

• Furusawa T

  Tokyo Inst. Technol. Yokohama

• MORIYAMA Shigeo

  Central Research Laboratory, Hitachi Ltd.

• Kusukawa Kikuo

  Central Research Laboratory Hitachi Ltd.

• Homma Y

  Hitachi Ltd. Tokyo Jpn

• Homma Yoshio

  Central Research Laboratory Hitachi Ltd.

• SATO Hidetada

  Hitachi Chemical Co. Ltd.

• Moriyama Shigeo

  Central Research Laboratory Hitachi Ltd.

関連論文

• Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing
• Heat and Moisture Resistance of Low-Capacitance Multilevel Interconnections Using Low-Permittivity Organic Spin-On Glass
• Time-Dependent Dielectric Breakdown of Interlevel Dielectrics for Copper Metallization
• Overlay Error Estimation of Wafer Rear Surface Alignment for 0.1-μm Lithography
• Directional Plasma CVD Technology for Sub-quarter-micron Feature Size Multilevel Interconnections
• Directional Plasma CVD Technology for Sub-Quarter Micrometer Feature Size Multilevel Interconnection
• Controlling the Solid-Phase Nucleation of Amorphous Si by Means of a Substrate Step Structure and Local Phosphorus Doping
• Low Permittivity Organic Dielectrics for Multilevel Interconnection in High Speed ULSIs
• Reliability of Low-Parasitic-Capacitance Multilevel Interconnection Using Surface-Densified Low-ε Organic Spin-on Glass
• Mechanically Ruled Stigmatic Concave Gratings : Diffiraction Gratings
• An End-point Detector for Planarization of Semiconductor Devices by Chemical Mechanical Polishing

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