Fast Electromigration-lifetime Prediction of Al-based Layered Metallization using the Similarity of Resistance Increase Curve
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概要
- 論文の詳細を見る
Electromigration characteristics are analyzed using the resistance increase curves of ten kinds of Al-based layered metallizations. It was found that the shape of the resistance curve is basically determined by the layered structure and its material, and that the resistance curve of each layered metallization tends to show a similar shape independent of current density. In particular the step, which appears at the specified amount of the resistance curve due to the difference in electromigration resistance of each layer, is a good index to understanding the degree of void growth in the metallization regardless of current density. We show application of the similarity of the resistance curve to a new method of fast electromigration-lifetime prediction. It can reduce the test time to less than one hundredth that of the conventional method which predicts the lifetime based on the Black's equation.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 1997-04-15
著者
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Hinode Kenji
Central Research Laboratory Hitachi Lid.
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Kondo Seiichi
Central Research Laboratory Hitachi Ltd.
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Deguchi Osamu
Toho University Faculty Of Science
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Kondo Seiichi
Central Research Laboratory, Hitachi, Ltd., Kokubunji, Tokyo 185, Japan
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