1832 超音波フリップチップ微細バンプ接合における動的接合メカニズム

概要

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This paper describes a new evaluation method for the dynamic bonding behavior of the microbump Ultrasonic Flip-chip Bonding (UFB). In order to elucidate the dynamic ultrasonic bonding mechanism on LISI packaging process with a microbump interconnection, we measured the ultrasonic amplitude of the chip and the substrate simultaneously during the bonding process. Consequently, the relative amplitude between the chip and the substrate was about 0.1μm, and this was considerably small compared with an amplitude of 3μm of the bonding tool. Then, we performed both a finite element analysis and a theoretical analysis based on the result of this relative amplitude, and examined a mechanical influence on the chip. As a result, it was shown that a desirable interconnection was enabled without the bonding damage to the chip in not only the Chip-on-Chip (COC) structure but also the multi-stacked LSI structure utilizing an ultrasonic bonding process.
社団法人日本機械学会の論文
2003-08-05