OS4(P)-13(OS04W0205) Evaluation of Residual Stress in TiN Thin Films Deposited by Arc-Ion-Plating with Synchrotron Radiation

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2003-09-09

著者

• Sakata Osami

  Experimental Facilities Division Japan Synchrotron Radiation Research Institute

• Sakata Osami

  Japan Synchrotron Research Institute

• Sakata Osami

  Japan Synchrotron Radiation Research Institute (jasri)

• Sakata Osami

  Japna Synchrotron Radiation Research Institute

• Sakata Osami

  Spring-8

• Noda Kazuhiro

  Tokushima Univ.

• Kusaka Kazuya

  Department Of Mechanical Engineering Tokushima University

• Hanabusa T

  Department Of Mechanical Engineering Tokushima University

• MATSUE Tatsuya

  Department of Material Engineering, Niihama National College of Technology

• Kusaka Kazuya

  Dept. of Mechanical Engineering, Tokushima Univ.

• Hanabusa Takao

  Dept. of Mechanical Engineering, Tokushima Univ.

• Matsue Tatsuya

  Dept. of Material Engineering, Niihama National Collage of Tech.

• Nishida Masayuki

  Dept. of Mechanical Engineering, Kobe City College of Tech.

• Matsue Tatsuya

  Department Of Material Engineering Niihama National College Of Technology

• Nishida Masayuki

  Department Of Mechanical Engineering Kobe City College Of Technology

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• Formation of Ultra-High-Density Ferromagnetic Column Arrays Beyond 1 Tera/inch^2 Using Porous Alumina Template(Nano-Fabrication and Patterned Media)
• Molecular Aggregation State of Surface-grafted Poly{2-(perfluorooctyl)ethyl acrylate} Thin Film Analyzed by Grazing Incidence X-ray Diffraction
• Analysis of Molecular Aggregation States in Pentacene Thin Films Prepared from Soluble Precursor
• Molecular Aggregation Structure of Poly(fluoroalkyl acrylate) Thin Films Evaluated by Synchrotron-sourced Grazing-incidence X-ray Diffraction
• Film Degradation in AlN Preparation by Facing Target System ( FERROELECTRIC MATERIALS AND THEIR APPLICATIONS)
• Metal/Semiconductor Interfaces Studies by Transmitted X-ray Reflectivity
• Evaluation of Internal Stresses in Single-, Double- and Multi-Layered TiN and TiAIN Thin Films by Synchrotron Radiation(Advanced Technology of Experimental Mechanics)
• OS4(P)-16(OS04W0240) Measurement of Residual Stress in Nano-Size Copper Thin Films by Synchrotron Radiation
• OS4(P)-13(OS04W0205) Evaluation of Residual Stress in TiN Thin Films Deposited by Arc-Ion-Plating with Synchrotron Radiation
• OS4(5)-22(OS04W0203) Evaluation of Internal Stresses in Single-, Double- and Multi-Layered TiN and TiAlN Thin Films by Synchrotron Radiation
• X-Ray Stress Measurement and Mechanical Properties of TiN Films Coated on Aluminum and Aluminum Alloy Substrates by Arc Ion Plating and Ion Beam Mixing
• Influence of Target Shape on Properties of AlN Sputtered Film
• OS4(P)-18(OS04W0258) Residual Stress Measurement of the Quenching Material by the Neutron Diffraction
• OS4(P)-12(OS04W0170) Residual Stress Measurement of Fiber Reinforced Metal Composite by Neutron and X-Ray Diffraction
• OS4(4)-18(OS04W0210) X-Ray and Neutron Diffraction Measurements of Residual Stresses in Cr, CrN and CrN on Cr Interlayer Films Deposited by Arc-Ion-Plating
• Structural characterization of Ar[+]-irradiated SrTiO3 showing room-temperature blue luminescence
• 27aXE-7 Ge(001) : Te 1×1 surface structure probed using X-ray scattering
• X-Ray Structural Study of Ge(001):Te 1×1 Performed at the Advanced Photon Source. II. Current Status of the Surface-Interface Structure Beamline at SPring-8
• Gas Pressure Dependence of AIN Film Properties in Alternating Sputtering System
• OS4(P)-15(OS04W0237) Residual Stress of Cu/TiN Films Deposited by Ion Plating and RF Sputtering
• OS4(P)-14(OS04W0209) Characteristic Evaluation of ZrO_2 Film Deposited by DC Magnetron Sputtering
• OS4(1)-2(OS04W0204) Effect of Powder Target on Crystal Orientation and Residual Stress in Sputtered GaN Film
• Effect of Plasma Protection Net on Crystal Orientation and Residual Stress in Sputtered Gallium Nitride Films(Materials Evaluation by X-ray and Neutron Diffractions)
• Special Issue on Materials Evaluation by X-ray and Neutron Diffractions(Materials Evaluation by X-ray and Neutron Diffractions)
• CHANGE IN RESIDUAL STRESSES OF TiN FILMS DUE TO ANNEALING TREATMENTS
• Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate
• Metal/Semiconductor Interfaces Studied by Transmitted X-ray Reflectivity

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