OS4(P)-15(OS04W0237) Residual Stress of Cu/TiN Films Deposited by Ion Plating and RF Sputtering
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概要
- 論文の詳細を見る
- 一般社団法人日本機械学会の論文
- 2003-09-09
著者
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Kusaka Kazuya
Department Of Mechanical Engineering Tokushima University
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Hanabusa T
Department Of Mechanical Engineering Tokushima University
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MATSUE Tatsuya
Department of Material Engineering, Niihama National College of Technology
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Kusaka Kazuya
Dept. of Mechanical Engineering, Tokushima Univ.
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Hanabusa Takao
Dept. of Mechanical Engineering, Tokushima Univ.
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Matsue Tatsuya
Dept. of Material Engineering, Niihama National Collage of Tech.
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Matsue Tatsuya
Department Of Material Engineering Niihama National College Of Technology
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Ikeuchi Yasukazu
Dept. of Material Engineering, Niihama National College of Tech.
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Ikeuchi Yasukazu
Dept. Of Material Engineering Niihama National College Of Tech.
関連論文
- Film Degradation in AlN Preparation by Facing Target System ( FERROELECTRIC MATERIALS AND THEIR APPLICATIONS)
- Evaluation of Internal Stresses in Single-, Double- and Multi-Layered TiN and TiAIN Thin Films by Synchrotron Radiation(Advanced Technology of Experimental Mechanics)
- OS4(P)-16(OS04W0240) Measurement of Residual Stress in Nano-Size Copper Thin Films by Synchrotron Radiation
- OS4(P)-13(OS04W0205) Evaluation of Residual Stress in TiN Thin Films Deposited by Arc-Ion-Plating with Synchrotron Radiation
- OS4(5)-22(OS04W0203) Evaluation of Internal Stresses in Single-, Double- and Multi-Layered TiN and TiAlN Thin Films by Synchrotron Radiation
- X-Ray Stress Measurement and Mechanical Properties of TiN Films Coated on Aluminum and Aluminum Alloy Substrates by Arc Ion Plating and Ion Beam Mixing
- Influence of Target Shape on Properties of AlN Sputtered Film
- OS4(P)-18(OS04W0258) Residual Stress Measurement of the Quenching Material by the Neutron Diffraction
- OS4(P)-12(OS04W0170) Residual Stress Measurement of Fiber Reinforced Metal Composite by Neutron and X-Ray Diffraction
- OS4(4)-18(OS04W0210) X-Ray and Neutron Diffraction Measurements of Residual Stresses in Cr, CrN and CrN on Cr Interlayer Films Deposited by Arc-Ion-Plating
- Gas Pressure Dependence of AIN Film Properties in Alternating Sputtering System
- OS4(P)-15(OS04W0237) Residual Stress of Cu/TiN Films Deposited by Ion Plating and RF Sputtering
- OS4(P)-14(OS04W0209) Characteristic Evaluation of ZrO_2 Film Deposited by DC Magnetron Sputtering
- OS4(1)-2(OS04W0204) Effect of Powder Target on Crystal Orientation and Residual Stress in Sputtered GaN Film
- Effect of Plasma Protection Net on Crystal Orientation and Residual Stress in Sputtered Gallium Nitride Films(Materials Evaluation by X-ray and Neutron Diffractions)
- Special Issue on Materials Evaluation by X-ray and Neutron Diffractions(Materials Evaluation by X-ray and Neutron Diffractions)
- CHANGE IN RESIDUAL STRESSES OF TiN FILMS DUE TO ANNEALING TREATMENTS
- Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate