OS4(4)-18(OS04W0210) X-Ray and Neutron Diffraction Measurements of Residual Stresses in Cr, CrN and CrN on Cr Interlayer Films Deposited by Arc-Ion-Plating

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概要

• 論文の詳細を見る
• 一般社団法人日本機械学会の論文
• 2003-09-09

著者

• Minakawa Nobuaki

  Advanced Science Research Center Japan Atomic Energy Research Inst.

• Minakawa Nobuaki

  Advanced Science Research Center Jaeri

• Moriai Atsushi

  Research Group For Neutron Residual Stress Analysis Quantum Beam Science Directorate Japan Atomic En

• Kusaka Kazuya

  Department Of Mechanical Engineering Tokushima University

• Hanabusa T

  Department Of Mechanical Engineering Tokushima University

• Kusaka Kazuya

  Dept. of Mechanical Engineering, Tokushima Univ.

• Hanabusa Takao

  Dept. of Mechanical Engineering, Tokushima Univ.

• Nishida Masayuki

  Dept. of Mechanical Engineering, Kobe City College of Tech.

• Miyagi Kazuhiro

  Tokushima Univ.

• Moriai Atsushi

  Dept. of Res. React., Japan Atomic Energy Research Inst. (JAERI)

• Nishida Masayuki

  Department Of Mechanical Engineering Kobe City College Of Technology

関連論文

• OS4(4)-16(OS04W0182) Neutron Diffraction Study of Residual Stress in the Induction Hardened S45C Round Bar
• Neutron Diffraction Measurement and Finite Element Method Calculation of Residual Stress of a Heat Treated Steel Pipe
• Neutron Diffraction Measurements of Inner Local Strain of Fatigued Carbon Steel
• Film Degradation in AlN Preparation by Facing Target System ( FERROELECTRIC MATERIALS AND THEIR APPLICATIONS)
• Neutron Diffraction Study of Thermal Residual Strain in Three Layered Materials Made by Self-propagating High-temperature Synthesis
• Neutron Diffraction Study of Thermal Residual Stress in Ceramic Composite
• Evaluation of Internal Stresses in Single-, Double- and Multi-Layered TiN and TiAIN Thin Films by Synchrotron Radiation(Advanced Technology of Experimental Mechanics)
• OS4(P)-16(OS04W0240) Measurement of Residual Stress in Nano-Size Copper Thin Films by Synchrotron Radiation
• OS4(P)-13(OS04W0205) Evaluation of Residual Stress in TiN Thin Films Deposited by Arc-Ion-Plating with Synchrotron Radiation
• OS4(5)-22(OS04W0203) Evaluation of Internal Stresses in Single-, Double- and Multi-Layered TiN and TiAlN Thin Films by Synchrotron Radiation
• X-Ray Stress Measurement and Mechanical Properties of TiN Films Coated on Aluminum and Aluminum Alloy Substrates by Arc Ion Plating and Ion Beam Mixing
• Influence of Target Shape on Properties of AlN Sputtered Film
• OS4(P)-18(OS04W0258) Residual Stress Measurement of the Quenching Material by the Neutron Diffraction
• OS4(P)-12(OS04W0170) Residual Stress Measurement of Fiber Reinforced Metal Composite by Neutron and X-Ray Diffraction
• OS4(4)-18(OS04W0210) X-Ray and Neutron Diffraction Measurements of Residual Stresses in Cr, CrN and CrN on Cr Interlayer Films Deposited by Arc-Ion-Plating
• OS4(4)-17(OS04W0082) Anisotropic Residual Stresses in a Pearlitic Steel after Tensile Deformation
• Distribution of Internal Stress by a Shrink-fit for the Aluminum Ring and Plug (Proceedings of the 1st International Symposium on Advanced Science Research(ASR-2000), Advances in Neutron Scattering Research)
• Gas Pressure Dependence of AIN Film Properties in Alternating Sputtering System
• OS4(P)-15(OS04W0237) Residual Stress of Cu/TiN Films Deposited by Ion Plating and RF Sputtering
• OS4(P)-14(OS04W0209) Characteristic Evaluation of ZrO_2 Film Deposited by DC Magnetron Sputtering
• OS4(1)-2(OS04W0204) Effect of Powder Target on Crystal Orientation and Residual Stress in Sputtered GaN Film
• Effect of Plasma Protection Net on Crystal Orientation and Residual Stress in Sputtered Gallium Nitride Films(Materials Evaluation by X-ray and Neutron Diffractions)
• High Tensile Strength of Low-Carbon Ferritic Steel Subjected to Severe Drawing
• Special Issue on Materials Evaluation by X-ray and Neutron Diffractions(Materials Evaluation by X-ray and Neutron Diffractions)
• CHANGE IN RESIDUAL STRESSES OF TiN FILMS DUE TO ANNEALING TREATMENTS
• OS4(P)-11(OS04W0169) Study of Residual Stress for C/C Composite by Neutron Scattering
• Residual Stress and In-situ Thermal Stress Measurements of Copper Films on Glass Substrate

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