銅めっき応力測定法による第2主応力の測定 : 円周みぞ底の曲げによる円周応力

概要

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The copper electroplating method of stress analysis utilizes the phenomenon that slip bands appear when the maximum shearing stress in the copper plating attains the proper value to the plating which is a function of the number of stress cycles. Accordingly, in the case of combined stress, it is generally impossible to obtain the second principal stress by the copper electroplating method. In this paper, a method that makes it possible to measure the second principal stress at the bottom of a circular groove subjected to bending is proposed, and measuring accuracy of this method is briefly discussed. Based on this method, stress concentration factors of the second principal stress are obtained. The results are in good agreement with previous results, and it is concluded that the method presented here can be used satisfactorily for the measurement of the second principal stress at the bottom of a groove.
一般社団法人日本機械学会の論文
1990-06-25