銅めっきはく疲労ゲージに関する基礎的研究 : 第2報, 成長粒子発生に及ぼす過小応力の影響

概要

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Fundamental investigations were made as to grain growth phenomenon in copper electroplating foil under a variable amplitude stress which consists of overstress and understress. The applicability of the foil to fatigue gauge that detects fatigue damage was discussed. It was found that the modified Miner's rule does not hold for the initiation of grown grains under such conditons as mentioned above. The cumulative cycle ratio is dependent on load histories. It was also found that fatigue damage under two-level multiple loading increases as the cycle ratio of overstress to understress increases. This indicates that fatigue damage during understress applied after overstress is greater in the early period of the cycles. Furthermore, it was found that the density of grown grains initiated under variable stress is dependent on the equivalent stress. This enables the evaluation of the equivalent stress based on the density of grown grains.
一般社団法人日本機械学会の論文
1990-05-25