銅めっき応力測定法に関する基礎的研究 : 変動応力下におけるすべり帯発生

概要

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In this paper, fundamental experiments are carried out to examine the occurrence of slip-bands (flecks) in copper electroplating foil under variable stresses. The following conclusions are drawn: (1) Miner's rule holds for the occurrence of slip-bands under two-level single block stressing; (2) The appearance of slip-bands is dominated by the amplitude of the primary stressing; (3) When different kinds of stresses act continuously on the plating foil, cumulative fatigue damage that causes the slip-initiation and the grain growth in the foil is not dominated by Miner's rule; (4) Both overstressing and understressing reduce the heating duration for the recrystallization of the copper plating foil and then promote the occurrence of slip-bands.
一般社団法人日本機械学会の論文
1986-04-25