微小円孔を有する電着銅薄膜の成長粒子発生密度を利用した二軸応力検出法

概要

論文の詳細を見る
In order to measure biaxial stresses by an electrodeposited copper foil with a microcircular hole both occurrence rate of slip bands at the periphery of microcircular holes in a copper foil and the number of cycles of grown grain occurrence in copper foil itself are used. However, it is necessary to stop the test frequently to seek the latter. In this report, in order to overcome this weakness, the posssibility of the use of grown grain density, which can be obtained to optional number of cycles, is examined. Namely, using three kinds of material adhered copper foil, the stress component which controlls the grown grain density in copper foil is examined under the combination of plane bending and cyclic torsion and the basic equations connecting the grown grain density, the stress amplitude and number of cycles are presented.
社団法人日本機械学会の論文
2003-03-25