円孔を有する電着鋼薄膜による成長粒子の分布形状を利用した二軸応力検出法 : 円孔の最小化と被測定物の弾性係数の影響

概要

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This is the experimental stress analysis that detects cyclic biaxial stress based on shape of grown grains occurred at the hole edge of copper foil with circular holes. In view of actual application, both the minimization of hole diameter and the effect of moduli of elasticity of the material were investigated in this report. It became clear that the minimum hole diameter and the measurement region were 0.2mm and about 15mm^2 respectively, since the difference of the grown grain shape didn't appear remarkably on 0.1mm hole diameter, even if the biaxial stress changed. And it was demonstrated that shape of grown grains was influenced by a shear strain that occurred to a copper foil. The constitutive equation for obtaining the biaxial stress was corrected in the form considering the effect of the moduli of elasticity of measured material on this method.
社団法人日本機械学会の論文
2006-08-25