BGAパッケージはんだ接合部の熱疲労信頼性簡易評価

概要

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The authors have proposed the estimating method of thermal fatigue reliability for solder joints of electronic package, using the total equivalent inelastic strain range Δε_in and Manson-Coffin's law. However, as it is difficult to calculate it in the case of huge models, it is needed to establish a simple calculation method of Δε_in. In this study, the authors proposed a simple approach of FEM analysis for calculation of Δε_in. Approximate formula for relative displacements of solder joint using the results of the elastic analysis was examined in order to simplify huge inelastic analysis. In addition, using Statistical Design Support System (SDSS), they made the equation of inelastic strain range in the solder joints. And proposed simple estimation method of thermal fatigue life.ＢＧＡアッセンブリ構造の信頼性評価のための非線形解析を線形解析による結果から算出する方法を提案し信頼性評価の簡便化を図った．
一般社団法人日本機械学会の論文
2001-02-25