単結晶シリコンの微小押込み試験 : 微小変形挙動と延性/ぜい性遷移領域の計測

概要

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Hard and brittle materials such as silicon, glass and ceramics have two modes of material removal, ductile and brittle. There is a ductile to brittle transition between two modes. When the depth or the force of a cut exceeds some threshold value (i.e., critical depth or force) , the material removal mode will change from ductile mode to brittle mode. If the critical depth or force can be obtained by a simple test, it can be expected to apply these values for the practical ductile mode cutting or grinding. In this study, a microindentation tester which can detect crack initiation by acoustic emissions (AE) sensor was developed. As a result, after the AE signals generate during microindentation test of single crystal silicon, the cracks are observed by an atomic force microscope (AFM). Therefore, the microindentation with the cracks length of greater than 1 μ m is defined as brittle mode and the critical values of ductile to brittle transition is obtained. The critical values in this microindentation tests are from 40mN to 50mN in load and from 0.55 μ m to 0.65 μ m in depth. The relationship between plastic deformation volume and plastic deformation energy was also discussed from the load-deformation characteristic curves in the microindentation tests.
公益社団法人精密工学会の論文
1998-11-05