Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface

元データ 2008-07-01 Japan Institute of Metals

著者

西川 宏 大阪大学接合科学研究所
NISHIKAWA Hiroshi Joining and Welding Research Institute, Osaka University
TAKEMOTO Tadashi Joining and Welding Research Institute, Osaka University
Komatsu Akira Graduate School Of Engineering Osaka University
Nishikawa Hiroshi Joining And Welding Res. Inst. Osaka Univ.
Takemoto Tadashi Joining And Welding Res. Inst. Osaka Univ.
西川 宏 大阪大学 接合科学研究所

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