Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-11-20
著者
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Shohji Ikuo
Faculty Of Engineering Gunma University
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Takemoto Tadashi
Joining And Welding Res. Inst. Osaka Univ.
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Yasuda Kiyokazu
Graduate School Of Engineering Osaka University
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Shohji Ikuo
Dep. Of Mechanical System Engineering Graduate School Of Engineering Gunma Univ.
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- Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface
- Interfacial Reaction between Sn-Ag-Co Solder and Metals
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- Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders
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- Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
- Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders
- Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index
- Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
- Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni
- Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls
- Evaluation of Absorbed Impact Energy of Sn–3.0Ag–0.5Cu (–xCo) Solder Joints with Co–P Plating a Using Ball Impact Test
- Measurement of erosion of stainless steel by molten lead-free solder using micro-focus X-ray CT system
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