Microstructure and Tensile Properties of Sn-3.0Ag-0.5Cu Bulk Solders with Minor Additive of Co and Ni
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概要
- 論文の詳細を見る
- 2006-09-01
著者
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NISHIKAWA Hiroshi
Joining and Welding Research Institute, Osaka University
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TAKEMOTO Tadashi
Joining and Welding Research Institute, Osaka University
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Nishikawa Hiroshi
Joining And Welding Res. Inst. Osaka Univ.
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CHENG Fangjie
Materials Science and Engineering School, Tianjin University
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CHENG Fangjie
Joining and Welding Research Institute, Osaka University
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Cheng Fangjie
Materials Science And Engineering School Tianjin University
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Takemoto Tadashi
Joining And Welding Res. Inst. Osaka Univ.
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