Low-Temperature Au--Au Bonding Using Nanoporous Au--Ag Sheets
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概要
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In this study, we proposed low-temperature Au--Au bonding using nanoporous Au--Ag sheets, fabricated by dealloying a Au--Ag sheet in HNO<inf>3</inf>solution, as a joint layer. The influence of the annealing temperature on the pore structure and chemical properties of the sheets was investigated. The chemical composition of the sheet was analyzed by X-ray photoelectron spectroscopy (XPS). It was found that the strength of Au--Au bonding with the nanoporous sheet increased. A sheet treated with liquid N<inf>2</inf>was also tested; the strength of the Au--Au bond increased as a result of this low-temperature treatment.
- 2013-05-25
著者
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Kasahara Takashi
Department Of Chemical Engineering Tohoku University
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Shoji Shuichi
Department Of Electrical Engineering And Bioscience Waseda University
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Nishikawa Hiroshi
Joining And Welding Res. Inst. Osaka Univ.
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Mizuno Jun
Institute for Nanoscience and Nanotechnology, Waseda University, Shinjuku, Tokyo 162-0041, Japan
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Saito Mikiko
Institute for Nanoscience and Nanotechnology, Waseda University, Shinjuku, Tokyo 162-0041, Japan
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Mimatsu Hayata
Department of Nanoscience and Nanoengineering, Waseda University, Shinjuku, Japan
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Mizuno Jun
Institute for Nanoscience and Nanotechnology, Waseda University
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